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1N5616 Datasheet - General

1N5616 Datasheet PDF General Semiconductor

Part Name
1N5616

Other PDF
  not available.

PDF

page
2 Pages

File Size
50.9 kB

MFG CO.
General
General Semiconductor GO URL

FEATURES
♦ High temperature metallurgically bonded construction
♦ 1.0 Ampere operation at TA= 55°C with no thermal runaway
♦ Typical IRless than 0.1µA
♦ Hermetically sealed package
♦ Capable of meeting environmental standards of MIL-S-19500
♦ High temperature soldering guaranteed:
350°C/10 seconds, 0.375” (9.5mm) lead length, 5 lbs. (2.3kg) tension

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