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CPD69 Datasheet - Central-Semiconductor

CPD69 Datasheet PDF Central Semiconductor

Part Name
CPD69

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2 Pages

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396.3 kB

MFG CO.
Central-Semiconductor
Central Semiconductor GO URL

General Purpose Rectifier
1 Amp Glass Passivated Rectifier Chip

PROCESS DETAILS
    Process GLASS PASSIVATED MESA
    Die Size 42.5 x 42.5 MILS
    Die Thickness 12.5 MILS
    Anode Bonding Pad Area 32 x 32 MILS
    Top Side Metalization Ni/Au - 5,000Å/2,000Å
    Back Side Metalization Ni/Au - 5,000Å/2,000Å

Page Link's: 1  2 

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