Features
⦠Glass passivated chip junction in DO-15 Package
⦠Low leakage
⦠Uni and Bidirectional unit
⦠Excellent clamping capability
⦠600W Peak power capability at 10 à 1000µs waveform Repetition rate (duty cycle):0.01%
⦠Fast response time: typically less than 1.0ps from 0 Volts to VBR min
⦠Typical IR less than 5μA above 12V.
⦠High Temperature soldering: 260°C/40 seconds at terminals
⦠Typical maximum temperature coefficient ÎVBR = 0.1% à VBR@25°Cà ÎT
⦠Plastic package has Underwriters Laboratory Flammability 94V-0
⦠Matte tin leadâfree Plated
⦠Halogen free and RoHS compliant
⦠Typical failure mode is short from over-specified voltage or current
⦠Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
⦠IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
⦠ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)
⦠EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)
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