Description
The IRL6283MTRPbF combines the latest HEXFET® N-Channel Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET® package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
Features and Benefits
â¢ï Environmentally Friendly Product
â¢ï RoHs compliant containing no Lead, no Bromide
and no Halogen
â¢ï Very Low RDS(on)
Applications
â¢ï ORing, eFuse, and high current
load switchï
â¢ï Load switch for battery
application
â¢ï Inverter switches for DC motor
application
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