FEATURES
â VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH
AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
â BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
â SURGE OVERLOAD RATING TO 200 AMPS PEAK
â IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
â UL RECOGNIZED - FILE #E141956
â RoHS COMPLIANT
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