Features
⢠For surface mounted applications
⢠Low-profile package
⢠Ideal for automated placement
⢠Low power loss, high efficiency
⢠High temperature soldering:
260 °C/10 seconds at terminals
⢠Lead (Pb)-free component
⢠Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
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