DESCRIPTION
The Max220TM package is a new high volume power package exibiting the same footprint as the industry standard TO-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled TO-220 designs and save board space with respect to larger packages.
â TYPICAL RDS(on) = 0.5 â¦
â ± 30V GATE TO SOURCE VOLTAGE RATING
â REPETITIVE AVALANCHE TESTED
â LOW INTRINSIC CAPACITANCE
â 100% AVALANCHE TESTED
â GATE CHARGE MINIMIZED
â REDUCED THRESHOLD VOLTAGE SPREAD
APPLICATIONS
â HIGH CURRENT, HIGH SPEED SWITCHING
â SWITCH MODE POWER SUPPLIES (SMPS)
â DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)
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