M40SZ100Y, M40SZ100W
Figure 11. Power Up Timing
VCC
VPFD (max)
VPFD
VPFD (min)
VSO
E
ECON
RST
tRB
VOHB
tR
tCER
tREC
tEPD
tEPD
PFO
VALID
AI03937
Table 6. Power Down/Up AC Characteristics
Symbol
Parameter(1)
Min
Max
Unit
tF(2)
VPFD (max) to VPFD (min) VCC Fall Time
300
µs
tFB(3)
VPFD (min) to VSS VCC Fall Time
10
µs
tPFD
PFI to PFO Propagation Delay
15
25
µs
tR
VPFD(min) to VPFD (max) VCC Rise Time
10
µs
M40SZ100Y
tEPD
Chip Enable Propagation Delay (Low or High)
M40SZ100W
10
ns
15
ns
tRB
VSS to VPFD (min) VCC Rise Time
1
µs
tCER
Chip Enable Recovery
40
120
ms
tREC
VPFD (max) to RST High
40
200
ms
tWPT
Write Protect Time
40
200
µs
Note: 1. Valid for Ambient Operating Temperature: TA = –40 to 85°C; VCC = 2.7 to 3.6V or 4.5 to 5.5V(except where noted).
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200 µs after VCC
passes VPFD (min).
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
10/19