TS925AI View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS925AI

Rail-to-Rail High Output Current Quad Operational Amplifiers With Standby Mode and Adjustable Phantom Ground

STMicroelectronics 

Package Mechanical Data

4 Package Mechanical Data

TS925

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com.

4.1

DIP16 Package

Plastic DIP-16 (0.25) MECHANICAL DATA

DIM.

a1

B

b

b1

D

E

e

e3

F

I

L

Z

MIN.

0.51

0.77

mm.

TYP

0.5

0.25

8.5

2.54

17.78

3.3

MAX.

1.65

20

7.1

5.1

1.27

MIN.

0.020

0.030

inch

TYP.

0.020

0.010

0.335

0.100

0.700

0.130

MAX.

0.065

0.787

0.280

0.201

0.050

14/17

P001C

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