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TS4872IJT(2002) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TS4872IJT Datasheet PDF : 29 Pages
First Prev 21 22 23 24 25 26 27 28 29
PIN OUT (top view)
7
6
5
Vin+
Vcc STDBY
8 Vout1
Vout2 4
Vin GND BYPASS
1
2
3
s Balls are underneath
MARKING (top view)
s Y : Year
s W : Week with two digits
s Example : 1254872
PACKAGE MECHANICAL DATA
FLIP CHIP - 8 BUMPS
s Die size : (3.02mm±10%) x (1.52mm ±10%)
s Die height (including bumps) : 540µm ±50µm
s Bump height : 140µm ±15µm (i.e. bump diameter of 185µm ±15µm)
s Silicon thickness : 400µm±25µm
s Pitch: 500µm ±10µm and 750µm±10µm
TS4872
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States
© http://www.st.com
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