STPCC0166BTC3 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STPCC0166BTC3

PC Compatible Embeded Microprocessor

STMicroelectronics 

Figure 6-4. Optimum layout for central ground ball

BOARD LAYOUT

Clearance = 6mil

External diameter = 37 mil

Via to Ground layer

hole diameter = 14 mil

Solder mask

diameter = 33 mil

Pad for ground ball

diameter = 25 mil

connections = 10 mil

The PBGA Package also dissipates heat through

peripheral ground balls. When a heat sink is

placed on the device, heat is more uniformely

spread throughout the moulding increasing heat

dissipation through the peripheral ground balls.

The more via pads are connected to each ground

ball, the more heat is dissipated . The only limita-

tion is the risk of lossing routing channels.

Figure 6-5 shows a routing with a good trade off

between thermal dissipation and number of rout-

ing channels.

Figure 6-5. Global ground layout for good thermal dissipation

Issue 1.2

Via to ground layer

Ground pad

45/51

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