STPCC4HEBI View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STPCC4HEBI

X86 Core PC Compatible Information Appliance System-on-Chip

STMicroelectronics 

DESIGN GUIDELINES

As the PCB acts as a heat sink, the layout of top

and ground layers must be done with care to

maximize the board surface dissipating the heat.

The only limitation is the risk of losing routing

channels. Figure 6-31 and Figure 6-32 show a

routing with a good thermal dissipation thanks to

an optimized placement of power and signal vias.

The ground plane should be on bottom layer for

the best heat spreading (thicker layer than internal

ones) and dissipation (direct contact with air). .

Figure 6-31. Layout for Good Thermal Dissipation - top layer

1

A

86/93

STPC ball

Via

Not Connected ball

GND ball

3.3V ball

2.5V ball (Core / PLLs)

Release 1.5 - January 29, 2002

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