USB6B1(2006) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
USB6B1 Datasheet PDF : 9 Pages
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Ordering information
Figure 10. SO-8 footprint (dimensions in mm)
6.8
0.6
4.2
1.27
USB6B1
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6
Ordering information
Ordering code
USB6B1
USB6B1RL
Marking
USB62
USB62
Package
SO-8
Weight
0.077 g
Base qty
100
2500
Delivery mode
Tube
Tape and reel
7
Revision history
Date
Oct-2003
03-May-2005
22-Feb-2006
16-Aug-2006
Revision
6A
7
8
9
Description of Changes
Previous issue.
Figure 1 on page 1: dots connection corrected.
Marking typing error corrected on page 1 and 7.
Reformated to current standard. ECOPACK statement
added. SO-8 package dimensions corrected.
8/9
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