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PIC12C509-04E/JW View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC12C509-04E/JW
Microchip
Microchip Technology 
PIC12C509-04E/JW Datasheet PDF : 113 Pages
First Prev 101 102 103 104 105 106 107 108 109 110 Next Last
PIC12C5XX
Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E
W
T
n
D
2
1
U
A
A2
c
B1
eB
B
A1
L
p
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1
Lead Thickness
c
Top to Seating Plane
A
Top of Body to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D
Package Width
E
Overall Row Spacing
eB
Window Diameter
W
Lid Length
T
Lid Width
U
* Controlling Parameter.
MIN
0.098
0.016
0.050
0.008
0.145
0.103
0.025
0.130
0.510
0.280
0.310
0.161
0.440
0.260
INCHES*
NOM
0.300
8
0.100
0.018
0.055
0.010
0.165
0.123
0.035
0.140
0.520
0.290
0.338
0.166
0.450
0.270
MAX
0.102
0.020
0.060
0.012
0.185
0.143
0.045
0.150
0.530
0.300
0.365
0.171
0.460
0.280
MILLIMETERS
MIN
NOM
7.62
8
2.49
2.54
0.41
0.46
1.27
1.40
0.20
0.25
3.68
4.19
2.62
3.12
0.64
0.89
3.30
3.56
12.95
13.21
7.11
7.37
7.87
8.57
4.09
4.22
11.18
11.43
6.60
6.86
MAX
2.59
0.51
1.52
0.30
4.70
3.63
1.14
3.81
13.46
7.62
9.27
4.34
11.68
7.11
© 1999 Microchip Technology Inc.
DS40139E-page 103

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