ADM1063ACPZ-REEL7(RevC) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADM1063ACPZ-REEL7
(Rev.:RevC)

Multisupply Supervisor/Sequencer with ADC and Temperature Monitoring

Analog Devices 

ADM1063

OUTLINE DIMENSIONS

6.00

BSC SQ

0.60 MAX

PIN 1

INDICATOR

TOP

VIEW

5.75

BSC SQ

0.50

BSC

0.50

0.40

0.30

12° MAX

1.00

0.85

0.80 SEATING

PLANE

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.30

0.23

0.20 REF COPLANARITY

0.18

0.08

0.60 MAX

31

40

30

1

EXPOSED

PAD

(BOT TOM VIEW)

21

10

20

11

4.50

REF

PIN 1

INDICATOR

4.25

4.10 SQ

3.95

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

Figure 46. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-1)

Dimensions shown in millimeters

1.20

0.75 MAX

0.60

0.45

1.05

1.00

0.95

0.15

0.05

0° MIN 0.20

0.09

7°

3.5°

SEATING

PLANE

0°

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

9.00

BSC SQ

48

1

37

36

PIN 1

TOP VIEW

(PINS DOWN)

7.00

BSC SQ

12

13

25

24

VIEW A 0.50

0.27

BSC

LEAD PITCH

0.22

0.17

COMPLIANT TO JEDEC STANDARDS MS-026ABC

Figure 47. 48-Lead Thin Plastic Quad Flat Package [TQFP]

(SU-48)

Dimensions shown in millimeters

Rev. C | Page 30 of 32

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