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TOP256MG View Datasheet(PDF) - Power Integrations, Inc

Part Name
Description
Manufacturer
TOP256MG
Power-Integrations
Power Integrations, Inc 
TOP256MG Datasheet PDF : 50 Pages
First Prev 41 42 43 44 45 46 47 48 49 50
-E-
.240 (6.10)
.260 (6.60)
Pin 1
-D-
.125 (3.18)
.145 (3.68)
.032 (.81)
.037 (.94)
TOP252-262
SMD-8C (G Package)
D S .004 (.10)
.372 (9.45)
.388 (9.86)
E S .010 (.25)
.137 (3.48)
.100 (2.54) (BSC) MINIMUM
.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 5)
.046 .060 .060 .046
.086
.186
.286
.080
.420
Pin 1
Solder Pad Dimensions
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.
.048 (1.22)
.053 (1.35)
.009 (.23)
.004 (.10)
.012 (.30)
.004 (.10)
.036 (0.91)
.044 (1.12)
0 °- 8°
G08C
PI-4015-101507
www.powerint.com
45
Rev. H 06/13

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