TOP252-262
eSIP-7F (L Package)
A
B
2
0.403 (10.24)
0.397 (10.08)
C
0.081 (2.06)
0.077 (1.96)
0.264 (6.70) Ref.
0.325 (8.25)
2 0.320 (8.13)
1
Pin 1 I.D.
0.050 (1.27)
Detail A
3
0.016 (0.41)
0.011 (0.28)
6×
0.020 M 0.51 M C
7
0.070 (1.78) Ref.
0.290 (7.37)
Ref.
0.490 (12.45) Ref.
0.084 (2.14)
0.173 (4.40)
0.163 (4.15) 7
0.047 (1.19) Ref.
0.129 (3.28)
0.122 (3.08)
0.100 (2.54)
0.198 (5.04) Ref.
1
0.089 (2.26)
0.079 (2.01)
34
0.033 (0.84) 6×
0.028 (0.71)
0.010 M 0.25 M C A B
BOTTOM VIEW
Exposed pad hidden
SIDE VIEW
TOP VIEW
Exposed pad up
0.060 (1.52) Ref. 1
7
0.021 (0.53)
0.019 (0.48)
0.019 (0.48) Ref.
0.378 (9.60)
Ref.
END VIEW
0.048 (1.22)
0.046 (1.17)
0.020 (0.50)
0.023 (0.58)
0.027 (0.70)
DETAIL A (Not drawn to scale)
Notes:
1. Dimensioning and tolerancing per ASME
Y14.5M-1994.
2. Dimensions noted are determined at the
outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate
burrs, and interlead flash, but including
any mismatch between the top and bottom
of the plastic body. Maximum mold
protrusion is 0.007 [0.18] per side.
3. Dimensions noted are inclusive of plating
thickness.
4. Does not include inter-lead flash or
protrusions.
5. Controlling dimensions in inches (mm).
PI-5204-061510
www.powerint.com
47
Rev. H 06/13