STM32F103ZEH7 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F103ZEH7

Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces

STMicroelectronics 

Package characteristics

STM32F103xC, STM32F103xD, STM32F103xE

6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 10: General operating conditions on page 42.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x JA)

Where:

● TA max is the maximum ambient temperature in °C,

● JA is the package junction-to-ambient thermal resistance, in C/W,

● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 70. Package thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

LFBGA144 - 10 × 10 mm / 0.8 mm pitch

Thermal resistance junction-ambient

LQFP144 - 20 × 20 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LFBGA100 - 10 × 10 mm / 0.8 mm pitch

JA

Thermal resistance junction-ambient

LQFP100 - 14 × 14 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

Thermal resistance junction-ambient

WLCSP64

Value

40

30

40

46

45

50

Unit

°C/W

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

114/123

Doc ID 14611 Rev 7

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