FDC37B80X View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
Manufacturer
FDC37B80X
SMSC -> Microchip
FDC37B80X Datasheet PDF : 194 Pages
| |||
D
D1
E
E1
e
W
A
A2
H
0.10
-C-
A1
DIM
A
A1
A2
D
D1
E
E1
H
L
L1
e
0
W
TD(1)
TE(1)
TD(2)
TE(2)
MIN
MAX
2.80
3.15
0.1
0.45
2.57
2.87
23.4
24.15
19.9
20.1
17.4
18.15
13.9
14.1
0.1
0.2
0.65
0.95
1.8
2.6
0.65 BSC
0°
12°
.2
.4
21.8
22.2
15.8
16.2
22.21
22.76
16.27
16.82
TD/TE
MIN
MAX
.110
.124
.004
.018
.101
.113
.921
.951
.783
.791
.685
.715
.547
.555
.004
.008
.026
.037
.071
.102
.0256 BSC
0°
12°
.008
.016
.858
.874
.622
.638
.874
.896
.641
.662
0
L
L1
Notes:
1) Coplanarity is 0.100mm (.004") maximum.
2) Tolerance on the position of the leads is
0.200mm (.008") maximum.
3) Package body dimensions D1 and E1 do not
include the mold protrusion. Maximum mold
protrusion is 0.25mm (.010").
4) Dimensions TD and TE are important for testing
by robotic handler. Only above combinations of (1)
or (2) are acceptable.
5) Controlling dimension: millimeter. Dimensions
in inches for reference only and not necessarily
accurate.
FIGURE 23 - 100 PIN QFP PACKAGE OUTLINE
192
Share Link: 