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COM20022V-HT View Datasheet(PDF) - SMSC -> Microchip

Part Name
Description
Manufacturer
COM20022V-HT Datasheet PDF : 88 Pages
First Prev 81 82 83 84 85 86 87 88
FIGURE 29 - 48 PIN TQFP PACKAGE OUTLINE
MIN
NOMINAL
A
~
~
A1
0.05
0.10
A2
1.35
1.40
D
8.80
9.00
D/2
4.40
4.50
D1
6.90
7.00
E
8.80
9.00
E/2
4.40
4.50
E1
6.90
7.00
H
0.09
~
L
0.45
0.60
L1
~
1.00
e
0.50 Basic
0o
~
W
0.17
~
R1
0.08
~
R2
0.08
~
ccc
~
~
ccc
~
~
Note 1:Controlling Unit: millimeter
MAX
1.6
0.15
1.45
9.20
4.60
7.10
9.10
4.60
7.10
0.20
0.75
~
7o
0.27
~
0.20
0.0762
0.08
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
81

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