FDC37C932APM View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
Manufacturer
FDC37C932APM
SMSC -> Microchip
FDC37C932APM Datasheet PDF : 280 Pages
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DETAIL "A"
R1
R2
0
L
5
L1
120
121
D
D1
3
81
80
E E1
D1/4
160
1
7
E1/4
A
A2
H
1
0.10 A1
-C-
TD / TE
SEE DETAIL "A"
W
2
e
41
40
4
0
M IN NOM
A
A1 0.05
MAX
4.07
0.5
A2 3.10
3.67
D
30.95 31.20 31.45
D1 27.90 28.00 28.10
E3 30.95 31.20 31.45
E1 27.90 28.00 28.10
H 0.10
0.200
L
0.65 0.80 0.95
L1
1.60
e
0.65BSC
0
0
W 0.20
7
0.40
R1
0.20
R2
0.30
TD
30.45
TE
30.45
Notes:
1) Coplanarity is 0.100 mm maximum
2) Tolerance on the position of the leads is 0.120
mm maximum
3) Package body dimensions D1 and E1 do not
include the mold protrusion. Maximum mold
protrusion is 0.25 mm
4) Dimensions TD and TE are important for testing
by robotic handler
5) Dimensions for foot length L w hen measured at
the centerline of the leads are given at the table
Dimension for foot length L w hen measured at
the gauge plane 0.25 mm above the seating
plane is 0.78 - 1.03 mm
6) Controlling dimension: millimeter
7) Details of pin 1 identifier are optional but must
be located w ithin the zone indicated
FIGURE 42 - 160 PIN QFP PACKAGE OUTLINES
279
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