ADP1610ARMZ-R7 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADP1610ARMZ-R7

1.2 MHz DC-to-DC Step-Up Switching Converter

Analog Devices 

LAYOUT PROCEDURE

To get high efficiency, good regulation, and stability, a well-

designed PCB layout is required. Where possible, use the

sample application board layout as a model.

When designing PCBs the following guidelines are to be used

(see Figure 2):

• The low ESR input capacitor (CIN) is to be kept close to IN

and GND.

• The high current path from CIN through the inductor L1 to

SW and PGND is to be kept as short as possible.

• The high current path from CIN through L1, the rectifier

D1, and the output capacitor COUT is to be kept as short as

possible.

• High current traces are to be kept as short and as wide as

possible.

• The feedback resistors are to be placed as close to the FB

pin as possible to prevent noise pickup.

• The compensation components are to be placed as close as

possible to COMP.

• To prevent radiated noise injection, high impedance traces

are not to be routed near any node connected to SW or

near the inductor.

ADP1610

Figure 32. Sample Application Board (Top Layer)

Figure 31. Sample Application Board (Bottom Layer)

Figure 33. Sample Application Board (Silkscreen Layer)

Rev. A | Page 17 of 20

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