GS84032B-166 View Datasheet(PDF) - Giga Semiconductor

Part Name

Description

Manufacturer

GS84032B-166

256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs

Giga Semiconductor 

TQFP Package Drawing

Symbol Description Min. Nom. Max

A1

Standoff

0.05 0.10 0.15

A2

Body Thickness 1.35 1.40 1.45

b

Lead Width

0.20 0.30 0.40

c

Lead Thickness 0.09

0.20

D

Terminal Dimension 21.9 22.0 22.1

D1

Package Body 19.9 20.0 20.1

E

Terminal Dimension 15.9 16.0 16.1

E1

Package Body 13.9 14.0 14.1

e

Lead Pitch

0.65

L

Foot Length

0.45 0.60 0.75

L1

Lead Length

1.00

Y

Coplanarity

0.10

θ

Lead Angle

0°

7°

Notes:

1. All dimensions are in millimeters (mm).

2. Package width and length do not include mold protrusion

θ

L

L1

c

e

b

A1

A2

GS84018/32/36T/B-180/166/150/100

E1

E

Rev: 2.05 6/2000

27/31

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com

© 1999, Giga Semiconductor, Inc.

.

This Material Copyrighted by Its Respective Manufacturer

Share Link: