L6285
THERMAL CHARACTERISTICS
The cooling of the device is obtained by soldering
its ground pins on a proper p.c.b copper side ,
acting as a true heatsink. By considering four
squared side as in Fig.10, the junction to ambient
Figure 10: Four ”on board” Square Heatsink
thermal resistance has been measured (see
Fig.11). The typical transient thermal resistance
versus values of single pulse width of power is
shown in Fig.12. In general these thermal charac-
teristics are very important to the designer to opti-
mize the L6285 applications.
Figure 11: Typical Rth j-amb vs. lenght ”l” (Fig. 10)
Figure 12: Typical Transient Thermal Resistance
vs. Time or Pulse Width
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