PIC16F1826-I View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F1826-I

18/20/28-Pin Flash Microcontrollers with nanoWatt XLP Technology

Microchip Technology 

PIC16F/LF1826/27

29.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA Thermal Resistance Junction to Ambient TBD

C/W 18-pin PDIP package

TBD

C/W 18-pin SOIC package

TBD

C/W 20-pin SSOP package

TBD

C/W 28-pin UQFN 4x4mm package

TBD

C/W 28-pin QFN 6x6mm package

TH02

JC Thermal Resistance Junction to Case

TBD

C/W 18-pin SPDIP package

TBD

C/W 18-pin SOIC package

TBD

C/W 20-pin SSOP package

TBD

C/W 28-pin UQFN 4x4mm package

TBD

C/W 28-pin QFN 6x6mm package

TH03

TJMAX Maximum Junction Temperature

150

C

TH04

TH05

PD Power Dissipation

PINTERNAL Internal Power Dissipation

—

W

PD = PINTERNAL + PI/O

—

W

PINTERNAL = IDD x VDD(1)

TH06

TH07

PI/O

PDER

I/O Power Dissipation

Derated Power

—

W

PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))

—

W

PDER = PDMAX (TJ - TA)/JA(2)

Legend: TBD = To Be Determined

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature

3: TJ = Junction Temperature

 2010 Microchip Technology Inc.

Preliminary

DS41391C-page 357

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