STM32F405OGY7TR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32F405OGY7TR Datasheet PDF : 185 Pages
| |||
STM32F405xx, STM32F407xx
Package characteristics
Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline
A1 ball location
D
e1
e
Detail A
E
Wafer back side
A2
A
Side view
Detail A
rotated by 90 °C
eee
Bump side
e
e2
G
F
A1
b
Seating plane
A0JW_ME
Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.520
0.570
0.620
0.0205
0.0224
0.0244
A1
0.165
0.190
0.215
0.0065
0.0075
0.0085
A2
0.350
0.380
0.410
0.0138
0.015
0.0161
b
0.240
0.270
0.300
0.0094
0.0106
0.0118
D
4.178
4.218
4.258
0.1645
0.1661
0.1676
E
3.964
3.969
4.004
0.1561
0.1563
0.1576
e
0.400
0.0157
e1
3.600
0.1417
e2
3.200
0.126
F
0.312
0.0123
G
0.385
0.0152
eee
0.050
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
DocID022152 Rev 4
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