STM32F407VEH6 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F407VEH6

ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera

STMicroelectronics 

STM32F405xx, STM32F407xx

Description

Note:

The following conditions must be respected:

• VDD should always be higher than VCAP_1 and VCAP_2 to avoid current injection

between power domains.

• If the time for VCAP_1 and VCAP_2 to reach V12 minimum value is faster than the time for

VDD to reach 1.8 V, then PA0 should be kept low to cover both conditions: until VCAP_1

and VCAP_2 reach V12 minimum value and until VDD reaches 1.8 V (see Figure 10).

• Otherwise, if the time for VCAP_1 and VCAP_2 to reach V12 minimum value is slower

than the time for VDD to reach 1.8 V, then PA0 could be asserted low externally (see

Figure 11).

• If VCAP_1 and VCAP_2 go below V12 minimum value and VDD is higher than 1.8 V, then

a reset must be asserted on PA0 pin.

The minimum value of V12 depends on the maximum frequency targeted in the application

(see Table 14: General operating conditions).

Figure 10. Startup in regulator OFF mode: slow VDD slope

- power-down reset risen after VCAP_1/VCAP_2 stabilization

PDR = 1.7 V or 1.8 V (2)

V12

Min V12

VDD

VCAP_1/VCAP_2

time

NRST

1. This figure is valid both whatever the internal reset mode (onON or OFFoff).

2. PDR = 1.7 V for reduced temperature range; PDR = 1.8 V for all temperature ranges.

time

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