TS4851 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TS4851
STMicroelectronics
TS4851 Datasheet PDF : 28 Pages
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Package Information
TS4851 Footprint recommendation
Φ=250µm
866µm
433µm
Φ=400µm
TS4851
75µm Min
100µm max.
Track
150µm min.
Non Solder mask opening
Package mechanical data
Symmetry axis
2440um
Symmetry axis
866um
354um
866um
Pad in Cu 18µm thickness with Flash NiAu (6µm, 0.15µm)
Die size: 2170µm x 2440µm ±30µm
Die height (including bumps): 600µm ±30µm
Bumps diameter: 315µm ±50µm
Bumps height: 250µm ±40µm
Pitch: 500µm ±10µm
600um
25/28
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