AT24C128C-WWU11M-B View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT24C128C-WWU11M-B

I2C-Compatible (2-Wire) Serial EEPROM 128-Kbit (16,384 x 8)

Atmel Corporation 

10.2 Ordering Code Information

Atmel Ordering Code

AT24C128C-SSHM-B

AT24C128C-SSHM-T

Lead Finish

Package

8S1

Delivery Information

Form

Quantity

Bulk (Tubes)

100 per Tube

Tape and Reel 4,000 per Reel

Operating

Range

AT24C128C-XHM-B

AT24C128C-XHM-T

AT24C128C-MAHM-T

Bulk (Tubes)

100 per Tube

8X

NiPdAu

Tape and Reel 5,000 per Reel

(Lead-free/Halogen-free)

5,000 per Reel

AT24C128C-MAHM-E

AT24C128C-MAHMML-T

8MA2

Tape and Reel 15,000 per Reel

5,000 per Reel

Industrial

Temperature

(-40°C to 85°C)

AT24C128C-MEHM-T

8ME1

Tape and Reel 5,000 per Reel

AT24C128C-CUM-T

AT24C128C-UUM0B-T(1)

AT24C128C-UUMML-T(1)

SnAgCu Ball

(Lead-free/Halogen-free)

8U2-1

4U-9

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

AT24C128C-WWU11M(2)

N/A

Wafer Sale

Note 2

Notes:

1. WLCSP Package:

 This device includes a backside coating to increase product robustness.

 CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells. Therefore,

customers who use a WLCSP product must ensure that exposure to ultraviolet light

does not occur.

2. Contact Atmel Sales for Wafer sales.

8S1

8X

8MA2

8ME1

8U2-1

4U-9

Package Type

8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)

8-pad, 1.80mm x 2.20mm body, Extra Thin DFN (XDFN)

8-ball, Die Ball Grid Array (VFBGA)

4-ball, 2 x 2 Grid Array, 0.40mm minimum pitch, Wafer Level Chip Scale Package (WLCSP)

14 AT24C128C [DATASHEET]

Atmel-8734D-SEEPROM-AT24C128C-Datasheet_082015

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