24LCS52I/MNY View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
24LCS52I/MNY Datasheet PDF : 36 Pages
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24AA52/24LCS52
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
X
Device Temperature Package Lead Finish
Range
Device:
24AA52: =
24AA52T: =
24LCS52: =
24LCS52T: =
1.8V, 2 Kbit I2C Serial EEPROM
1.8V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
2.2V, 2 Kbit I2C Serial EEPROM
2.2V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
Temperature I
Range:
= -40°C to +85°C
Package:
P=
SN =
ST =
MS =
MC =
MNY(1)=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
Micro Lead Frame (2x3 mm body), 8-lead
TDFN (2x3x0.75 mm body), 8-lead (Tape
and Reel only)
Examples:
a) 24AA52-I/P: Industrial Temperature,
1.8V, PDIP package
b) 24AA52-I/SN: Industrial Temperature,
1.8V, SOIC package
c) 24AA52T-I/MS: Tape and Reel, Industrial
Temperature, 1.8V, MSOP package
d) 24LCS52-I/P: Industrial Temperature,
2.2V, PDIP package
e) 24LCS52-I/MC: Industrial Temperature,
2.2V, DFN package
f) 24LCS52T-I/MS: Tape and Reel,
Industrial Temperature, 2.2V, MSOP
package
g) 24LCS52T-I/MNY: Tape and Reel, Indus-
trial Temperature, 2.2V, TDFN package
Note 1: "Y" indicates a Nickel Palladium Gold (NiPdAu) finish.
1996-2011 Microchip Technology Inc.
DS21166K-page 33
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