AD5338RBCPZ-RL7(Rev0) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD5338RBCPZ-RL7
(Rev.:Rev0)

Dual, 10-Bit nanoDAC with 2 ppm/°C Reference, I2C Interface

Analog Devices 

AD5338R

OUTLINE DIMENSIONS

Data Sheet

PIN 1

INDICATOR

0.80

0.75

0.70

SEATING

PLANE

3.10

3.00 SQ

2.90

TOP VIEW

0.50

BSC

0.30

0.23

0.18

13

12

16

1

EXPOSED

PAD

PIN 1

INDICATOR

1.75

1.60 SQ

1.45

0.50

0.40

9

8

4

5

BOTTOM VIEW

0.25 MIN

0.30

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.20 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-22)

Dimensions shown in millimeters

5.10

5.00

4.90

16

9

4.50

4.40

4.30

1

6.40

BSC

8

PIN 1

1.20

0.15

MAX

0.20

0.05

0.09

0.75

0.30

8°

0.60

0.65

BSC

0.19 SEATING

PLANE

0°

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 55. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

AD5338RBCPZ-RL7

AD5338RBRUZ

AD5338RBRUZ-RL7

Resolution

10 Bits

10 Bits

10 Bits

Temperature

Range

−40°C to +105°C

−40°C to +105°C

−40°C to +105°C

Accuracy

±1 LSB INL

±1 LSB INL

±1 LSB INL

1 Z = RoHS Compliant Part.

Reference

Temperature

Coefficient

(ppm/°C)

±5 (max)

±5 (max)

±5 (max)

Package

Description

16-Lead LFCSP_WQ

16-Lead TSSOP

16-Lead TSSOP

Package

Option

CP-16-22

RU-16

RU-16

Branding

DKX

Rev. 0 | Page 26 of 28

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