AD8045ARDZ-REEL7(RevB) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD8045ARDZ-REEL7 Datasheet PDF : 26 Pages
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AD8045
Data Sheet
OUTLINE DIMENSIONS
5.00
4.90
4.80
2.29
0.356
8
5
6.20
4.00 6.00
3.90 5.80
3.80
0.457
1
4
1.27 BSC
1.75
1.35
TOP VIEW
3.81 REF
1.65
1.25
BOTTOM VIEW
0.50 45°
0.25
SEATING
PLANE
0.10 MAX
0.51
0.31
0.05 NOM
8°
COPLANARITY 0°
0.10
1.04 REF
2.29
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.25
0.17
1.27
0.40
COMPLIANT TO JEDEC STANDARDS MS-012-A A
Figure 77. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-1)
Dimensions shown in millimeters
3.10
3.00 SQ
2.90
1.84
1.74
1.64
5
0.50 BSC
8
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
EXPOSED
PAD
1.55
1.45
1.35
4
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 78. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD8045ARDZ
AD8045ARDZ-REEL7
AD8045ACPZ-R2
AD8045ACPZ-REEL7
Minimum
Ordering Quantity
1
1,000
250
1,500
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead SOIC_N_EP
8-Lead SOIC_N_EP
8-Lead LFCSP
8-Lead LFCSP
Package Option
RD-8-1
RD-8-1
CP-8-13
CP-8-13
1 Z = RoHS Compliant Part.
Branding
H8B
H8B
©2004–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04814-0-5/16(B)
Rev. B | Page 24 of 24
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