Data Sheet
AD8364
OUTLINE DIMENSIONS
5.00
BSC SQ
PIN 1
INDICATOR
4.75
BSC SQ
0.60 MAX
0.50
BSC
1.00
0.85
0.80
12° MAX
TOP VIEW
0.80 MAX
0.65 TYP
SEATING
0.30
PLANE
0.25
0.18
0.50
0.40
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF 0.08
0.60 MAX
25
32
24
1
EXPOSED
PAD
PIN 1
INDICATOR
3.45
3.30 SQ
3.15
17
8
16
9
BOTTOM VIEW
3.50 REF
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model1
AD8364ACPZ-WP
AD8364ACPZ-REEL7
AD8364ACPZ-R2
AD8364-EVALZ
Notes
2
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 85. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-3)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Package
Option
CP-32-3
CP-32-3
CP-32-3
1 Z = RoHS Compliant Part.
2 WP = Waffle Pack.
Ordering
Quantity
36 Units
1,500 Units
250 Units
Rev. B | Page 41 of 44