AD8375ACPZ-WP View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD8375ACPZ-WP Datasheet PDF : 24 Pages
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AD8375
OUTLINE DIMENSIONS
Data Sheet
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
SIDE VIEW
0.50
BSC
0.30
0.25
0.20
19
18
24
1
EXPOSED
PAD
DETAIL A
(JEDEC 95)
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
2.20
2.10 SQ
2.00
13
6
0.50
0.40
12
7
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.203 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8.
Figure 51. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-24-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
AD8375ACPZ-WP −40°C to +85°C
AD8375ACPZ-R7
−40°C to +85°C
AD8375-EVALZ
Package Description
24-Lead Lead Frame Chip Scale Package [LFCSP], Waffle Pack
24-Lead Lead Frame Chip Scale Package [LFCSP], 7”Tape and Reel
Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
CP-24-10
CP-24-10
Rev. B | Page 22 of 24
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