AD8662ARMZ-REEL(RevE) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD8662ARMZ-REEL
(Rev.:RevE)

Low Noise, Precision 16 V CMOS, Rail-to-Rail Operational Amplifiers

Analog Devices 

Data Sheet

OUTLINE DIMENSIONS

AD8661/AD8662/AD8664

5.00 (0.1968)

4.80 (0.1890)

8

4.00 (0.1574)

3.80 (0.1497) 1

5

6.20 (0.2440)

4 5.80 (0.2284)

0.25 (0.0098)

0.10 (0.0040)

1.27 (0.0500)

BSC

1.75 (0.0688)

1.35 (0.0532)

COPLANARITY

0.10

SEATING

PLANE

0.51 (0.0201)

0.31 (0.0122)

0.50 (0.0196) 45°

0.25 (0.0099)

8°

0°

1.27 (0.0500)

0.25 (0.0098) 0.40 (0.0157)

0.17 (0.0067)

COMPLIANT TO JEDEC STANDARDS MS-012-A A

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 34. 8-Lead Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

PIN 1 INDEX

AREA

0.80

0.75

0.70

SEATING

PLANE

3.10

3.00 SQ

2.90

1.84

1.74

1.64

5

0.50 BSC

8

TOP VIEW

SIDE VIEW

0.30

0.25

0.20

0.50

0.40

0.30

EXPOSED

PAD

1.55

1.45

1.35

4

1

BOTTOM VIEW

PIN 1

INDICATOR

(R 0.15)

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.203 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4

Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

Rev. E | Page 13 of 16

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