AD9783-DPG2-EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9783-DPG2-EBZ Datasheet PDF : 32 Pages
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Data Sheet
AD9780/AD9781/AD9783
OUTLINE DIMENSIONS
10.10
10.00 SQ
9.90
PIN 1
INDICATOR
TOP VIEW
9.85
9.75 SQ
9.65
0.60
0.42
0.24
0.60
0.42
0.24
55
54
0.50
BSC
EXPOSED
PAD
72 1
PIN 1
INDICATOR
4.70
BSC SQ
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
0.30
(BOTTOM VIEW)
37
36
18
19
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF
0.08
8.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
Figure 74. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm, Very Thin Quad
(CP-72-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9780BCPZ
AD9780BCPZRL
AD9781BCPZ
AD9781BCPZRL
AD9783BCPZ
AD9783BCPZRL
AD9783-DPG2-EBZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
Evaluation Board
Package Option
CP-72-1
CP-72-1
CP-72-1
CP-72-1
CP-72-1
CP-72-1
Rev. B | Page 31 of 32
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