AD9780-EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9780-EBZ Datasheet PDF : 36 Pages
| |||
AD9780/AD9781/AD9783
OUTLINE DIMENSIONS
10.00
BSC SQ
PIN 1
INDICATOR
TOP VIEW
9.75
BSC SQ
0.60
0.42
0.24
0.50
BSC
0.60
0.42
0.24
55
54
(BOTTOM VIEW)
EXPOSED
PAD
72 1
PIN 1
INDICATOR
4.70
BSC SQ
0.50
0.40
37
36
0.30
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF
0.08
8.50 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
Figure 79. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm, Very Thin Quad
(CP-72-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9780BCPZ1
AD9780BCPZRL1
AD9781BCPZ1
AD9781BCPZRL1
AD9783BCPZ1
AD9783BCPZRL1
AD9780-EBZ1
AD9781-EBZ1
AD9783-EBZ1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
Evaluation Board
Evaluation Board
Evaluation Board
1 Z = RoHS Compliant Part.
18
19
EXPOSED PAD MUST BE
SOLDERED TO PCB AND
CONNECTED TO AVSS.
Package Option
CP-72-1
CP-72-1
CP-72-1
CP-72-1
CP-72-1
CP-72-1
Rev. A | Page 35 of 36
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