Data Sheet
ADN2891
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
TOP VIEW
0.50
BSC
0.30
0.25
0.20
13
12
16
1
EXPOSED
PAD
DETAIL A
(JEDEC 95)
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
1.65
1.50 SQ
1.45
9
4
0.50
0.40
8
5
BOTTOM VIEW
0.20 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 22. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-27)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADN2891ACPZ-500RL7
ADN2891ACPZ-RL7
ADN2891ACPZ-RL
EVAL-ADN2891EBZ
1 Z = RoHS Compliant Part.
Temperature Range
–40°C to +95°C
–40°C to +95°C
–40°C to +95°C
Package Description
16-Lead LFCSP, 500 pieces
16-Lead LFCSP, 1,500 pieces
16-Lead LFCSP, 5,000 pieces
Evaluation Board
Package Option
CP-16-27
CP-16-27
CP-16-27
Branding
F04
F04
F04
Rev. B | Page 13 of 16