ADP151ACBZ-2.75-R7(Rev0) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADP151ACBZ-2.75-R7 Datasheet PDF : 24 Pages
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ADP151
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 49 and Figure 50).
Maximum junction temperature (TJ) is calculated from the
board temperature (TB) and power dissipation (PD) using the
following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package
and 43°C/W for the 5-lead TSOT package.
140
MAXIMUM JUNCTION TEMPERATURE
120
100
80
60
40
20
ILOAD = 1mA
ILOAD = 100mA
ILOAD = 10mA
ILOAD = 150mA
ILOAD = 50mA
ILOAD = 200mA
0
0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8
VIN – VOUT (V)
Figure 49. WLCSP, TA = 85°C
140
MAXIMUM JUNCTION TEMPERATURE
120
100
80
60
40
20
ILOAD = 1mA
ILOAD = 100mA
ILOAD = 10mA
ILOAD = 150mA
ILOAD = 50mA
ILOAD = 200mA
0
0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8
VIN – VOUT (V)
Figure 50. TSOT, TA = 85°C
Rev. 0 | Page 18 of 24
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