ADP2370/ADP2371
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
2.48
3.00
2.38
BSC SQ
2.23
INDEX
AREA
0.80
0.75
0.70
TOP VIEW
0.80 MAX
0.55 NOM
SEATING
PLANE
0.30 0.50 BSC
0.25
0.18
0.50
0.40
0.30
5
8
EXPOSED
PAD
4
1
BOTTOM VIEW
1.74
1.64
1.49
PIN 1
INDICATOR
(R 0.2)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model1
ADP2370ACPZ-1.2-R7
ADP2370ACPZ-1.5-R7
ADP2370ACPZ-1.8-R7
ADP2370ACPZ-2.5-R7
ADP2370ACPZ-3.0-R7
ADP2370ACPZ-3.3-R7
ADP2370ACPZ-5.0-R7
ADP2370ACPZ-R7
ADP2371ACPZ-1.2-R7
ADP2371ACPZ-1.8-R7
ADP2371ACPZ-3.3-R7
ADP2371ACPZ-R7
ADP2370CPZ-REDYKIT
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 93. 8-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-8-5)
Dimensions shown in millimeters
Buck Output Voltage (V)
1.2
1.5
1.8
2.5
3.0
3.3
5.0
Adjustable
1.2 with QOD
1.8 with QOD
3.3 with QOD
Adjustable with QOD
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
REDYKIT
Package Option
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
1 Z = RoHS Compliant Part.
Branding
LL4
LL5
LL6
LL7
LL8
LL9
LLB
LGZ
LLJ
LLK
LLL
LLM
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09531-0-5/12(A)
Rev. A | Page 32 of 32