ADP7104CPZ-REDYKIT(RevB) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADP7104CPZ-REDYKIT Datasheet PDF : 28 Pages
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ADP7104
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 76 and Figure 77).
Maximum junction temperature (TJ) is calculated from
the board temperature (TB) and power dissipation (PD)
using the following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package
and 31.3°C/W for the 8-lead SOIC package.
140
120
100
80
60
40
TB = 25°C
20
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TOTAL POWER DISSIPATION (W)
Figure 76. LFCSP
Data Sheet
140
120
100
80
60
40
20
0
0
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TOTAL POWER DISSIPATION (W)
Figure 77. SOIC
Rev. B | Page 22 of 28
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