M24128-DWMH6TP View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

M24128-DWMH6TP

128-Kbit serial I²C bus EEPROM

STMicroelectronics 

M24128-BW M24128-BR M24128-BF M24128-DF

Revision history

Date

25-Nov-2014

03-Apr-2015

02-Oct-2015

22-Jun-2016

14-Feb-2017

13-Sep-2017

Table 25. Document revision history (continued)

Revision

Changes

Updated:

– Section 5.1.5

– Table 8 and Table 13

– Note 1 and 2 on Table 11

– Note 1 and 2 on Table 12

– Section 9

25

– Notes on Table 13, Table 14, Table 15, Table 16, Table 17 and

Table 22

Added:

– Figure 3

– Figure 22

– Note 8 on Table 15.

– Reference to Engineering sample on Table 23

Removed Note 2 on Table 14.

Added:

– Unsawn wafer reference on cover page and Table 24: Ordering

26

information scheme (unsawn wafer)

Updated:

– note 2 on Table 12

27

Updated Figure 16 and Table 18

28

Updated Table 24: Ordering information scheme (unsawn wafer)

Update: Table 9: AC measurement conditions, Table 22: WLCSP - 8-

29

bump, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Added reference to DFN8 and DFN5 in: cover page figure, Figure 3:

UFDFPN5 (DFN5) package connections, Section 9.1: UFDFPN5

(DFN5) package information, Section 9.2: UFDFPN8 (DFN8) package

30

information and Table 23: Ordering information scheme

Added Figure 17: UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm

thickness, ultra thin fine pitch dual flat package, no lead

recommended footprint

DocID16892 Rev 30

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