APA2020 View Datasheet(PDF) - Anpec Electronics
Part Name
Description
Manufacturer
APA2020 Datasheet PDF : 25 Pages
| |||
APA2020
Packaging Information
TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153)
e
N
2x E/2
E1 E
1 23
e/2
D
b
D1
EXPOSED THERMAL
PAD ZONE
A2
A
A1
E2
0.25
BOTTOM VIEW
(THERMALLY ENHANCED VARIATIONDS ONLY)
( 2)
S
GAUGE
PLANE
( 3)
L
1
(L1)
Dim
A
A1
A2
D
D1
e
E
E1
E2
L
L1
R
R1
S
φ1
φ2
φ3
M illim eters
M in.
Max.
1.2
0.00
0.15
0.80
1.05
6.4 (N=20PIN) 6.6 (N=20PIN)
7.7 (N=24PIN) 7.9 (N=24PIN)
9.6 (N=28PIN) 9.8 (N=28PIN)
4.2 BSC (N=20PIN)
4.7 BSC (N=24PIN)
3.8 BSC (N=28PIN)
0.65 BSC
6.40 BSC
4.30
4.50
3.0 BSC (N=20PIN)
3.2 BSC (N=24PIN)
2.8 BSC (N=28PIN)
0.45
0.75
1.0 REF
0.09
0.09
0.2
0°
8°
12° REF
12° REF
Copyright ANPEC Electronics Corp.
22
Rev. A.8 - Nov., 2002
Inches
M in.
Max.
0.047
0.000
0.006
0.031
0.041
0.252 (N=20PIN) 0.260 (N=20PIN)
0.303 (N=24PIN ) 0.311 (N=24PIN )
0.378 (N=28PIN) 0.386 (N=28PIN)
0.165 BSC (N=20PIN)
0.188 BSC (N=24PIN)
0.150 BSC (N=28PIN)
0.026 BSC
0.252 BSC
0.169
0.177
0.118 B SC (N =20P IN )
0.127 BSC (N=24PIN)
0.110 B SC (N =28P IN )
0.018
0.030
0.039REF
0.004
0.004
0.008
0°
8°
12° REF
12° REF
www.anpec.com.tw
Share Link: 