APL3200
Applicaiton Information (Cont.)
Thermal Consideration (Cont.)
P =(V -V ) x I
(or I
)
D
DCLV BATT
CHG_DC
CHG_USB
PCB Layout Consideration
The APL3200 is packaged in a thermally enhanced QFN
package. The package includes a thermal pad to provide
an effective thermal contact between the device and the
printed circuit board. Connecting the exposed pad to a
large copper ground plane on the backside of the circuit
board through several thermal vias for heatsinking is
recommended. Connecting the battery to BATT as close
to the device as possible provides accurate battery volt-
age sensing. All decoupling capacitors and filter capaci-
tors should be placed as close as possible to the device.
The high-current charge paths into DC, DCLV, USB, and
from the BATT pins must short and wide to minimize volt-
age drops.
Copyright © ANPEC Electronics Corp.
18
Rev. A.5 - Apr., 2009
www.anpec.com.tw