AT24C02C-PHM-B View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT24C02C-PHM-B

Two-wire Serial Electrically Erasable and Programmable Read-only Memory

Atmel Corporation 

Atmel AT24C02C

11. Ordering Codes

Atmel AT24C02C Ordering Information

Ordering Code

AT24C02C-PUM (Bulk form only)

AT24C02C-SSHM-B(1) (NiPdAu Lead Finish)

AT24C02C-SSHM-T(2) (NiPdAu Lead Finish)

AT24C02C-XHM-B(1) (NiPdAu Lead Finish)

AT24C02C-XHM-T(2) (NiPdAu Lead Finish)

AT24C02C-MAHM-T(2) (NiPdAu Lead Finish)

AT24C02C-STUM-T(2)

AT24C02C-CUM-T(2)

AT24C02C-WWU11(3)

Voltage

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

1.7V to 5.5V

Package

8P3

8S1

8S1

8A2

8A2

8Y6

5TS1

8U3-1

Die Sale

Operation Range

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

Industrial Temperature

(–40°C to 85°C)

Notes:

1. “-B” denotes bulk

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, UDFN, SOT23, and VFBGA = 5K per reel

3. For Wafer sales, please contact Atmel Sales

8P3

8S1

8A2

8Y6

5TS1

8U3-1

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Dual No Lead Package (UDFN)

5-lead, 2.90mm x 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Array Package (VFBGA)

15

8700D–SEEPR–8/10

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