20. Ordering Code: Y6H-T
20.1. 8-lead Ultra Thin Mini-Map
Pin 1
Index
Area
A
D2
b
(8X)
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-229, for proper
dimensions, tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from
the terminal tip. If the terminal has the optional
radius on the other end of the terminal, the
dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but
not recommended. No electrical connection is
accomplished to the device through this pad, so
if soldered it should be tied to ground
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
MIN
1.40
-
-
0.0
-
0.20
0.20
NOM
2.00 BSC
3.00 BSC
1.50
-
-
0.02
-
0.20 REF
0.30
0.50 BSC
0.25
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
NOTE
2
11/21/08
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
GPC DRAWING NO. REV.
8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package YNZ
8Y6
E
(Sawn)(UDFN)
22 AT88SC0104CA
5200ES–CRYPT–08/09