BA4560RFVM-TR(2014) View Datasheet(PDF) - ROHM Semiconductor
Part Name
Description
Manufacturer
BA4560RFVM-TR Datasheet PDF : 52 Pages
| |||
BA4560xxx BA4560Rxxx BA4564RFV BA4564WFV
Datasheet
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA =25℃(normal temperature). IC is
heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and
thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 94.(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, junction temperature TJMAX, and power dissipation PD can be calculated by the equation below:
θJA = (TJMAX - TA) / PD ℃/W
Derating curve in Figure 94. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 95.(c), to ,
(e) show a derating curve for an example of BA4560xxx, BA4560Rxxx, BA4564RFV, BA4564WFV.
θJA=(TJmax-TA)/ PD °C/W
Ambient Temperature TA [ °C ]
Power Dissipation of LSI [W]
PD(max)
P2
P1
θJA2 < θJA1
θ’JA2 θJA2
θ’JA1 θJA1
TJ’max TJmax
Chip Surface Temperature TJ [ °C ]
0
25
50
75
100 125 150
Ambient Temperature TA [ °C ]
(a) Thermal Resistance
(b) Derating Curve
Figure 94. Thermal Resistance and Derating Curve
1
0.8
0.6
0.4
0.2
0
0
1
0.8
BA4560F(Note 17)
0.6
BA4560FJ(Note 18)
BA4560FV/FVT(Note 19)
BA4560FVM(Note 20)
0.4
0.2
0
25
50
75
100
125
0
AAMMBBIIEENNTTTTEEMMPPEERRTAUTRUERE[℃T]A[℃. ]
(c)BA4560xxx
1
BA4560F(Note 17)
0.8
BA4560FJ(Note 18)
BA4560FV/FVT(Note 19)
0.6
BA4560FVM(Note 20)
0.4
BA4564RFV/WFV(Note 21)
0.2
25
50
75
100
125
AAMMBBIIEENNTTTTEEMMPPEERRATTUURREE[℃TA] [℃. ]
(d)BA4560Rxxx
0
0
25
50
75
100
125
AMBIENT TEMPERATURE TA [℃] .
(e)BA4564RFV/BA4564WFV
(Note 17) (Note 18) (Note 19) (Note 20) (Note 21)
Unit
5.5
5.4
5.0
4.7
7.0
mW/℃
When using the unit above TA=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 95. Derating Curve
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19.Nov.2014 Rev.003
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