DSPIC30F9013BT-20E/ML View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
DSPIC30F9013BT-20E/ML Datasheet PDF : 220 Pages
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dsPIC30F3014/4013
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
123
D
E
A
A2
L
c
b1
A1
b
e
eB
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
40
Pitch
e
.100 BSC
Top to Seating Plane
A
–
–
.250
Molded Package Thickness
A2
.125
–
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.590
–
.625
Molded Package Width
E1
.485
–
.580
Overall Length
D
1.980
–
2.095
Tip to Seating Plane
L
.115
–
.200
Lead Thickness
c
.008
–
.015
Upper Lead Width
b1
.030
–
.070
Lower Lead Width
b
.014
–
.023
Overall Row Spacing §
eB
–
–
.700
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-016B
DS70138E-page 204
© 2007 Microchip Technology Inc.
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