ESDALC6V1M3(2006) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ESDALC6V1M3 Datasheet PDF : 8 Pages
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Package information
ESDALC6V1M3
Figure 13. ST Ecopack® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Figure 14. Packing information
Cathode bar
2.0 ± 0.05 4.0 ± 0.1
Ø 1.5 ± 0.1
0.66 ± 0.05
0.68 ± 0.05
4.0 ± 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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