Application information
L6208
Figure 31. PowerDIP24 junction ambient thermal resistance versus on-board copper
area
& :
&RSSHUDUH DLV
RQERWWRPVLGH
&RSSHUD L UH DLV
RQWRSVLGH
V T FP
2QERDUGFRSSHUDUHD
$0
Figure 32. SO24 junction ambient thermal resistance versus on-board copper area
& :
&RSSHUDUHD
LVRQWRSVLGH
VT F P
2QERDUGFRSSHUDUHD
$0
Figure 33. Mounting the PowerSO package
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
28/35
DocID7514 Rev 2